Ph.D., Information Engineering
Student, Chinese University of Hong Kong
Curriculum Vitae | Blog

I am a Ph.D. student at MMLab, the Chinese University of Hong Kong, advised by Prof. Xiangyu Yue. Previously, I am a researcher at Tencent Hunyuan. Before that, I received my Master and B.S. in Computer Science and Technology from Beijing Institute of Technology in 2023 and 2020, advised by Prof. Ying Fu.

My current research focus on the generative models, especially 3D foundation models, e.g. Hunyuan3D-2, Hunyuan3D-2.5, and Hunyuan3D-3.0. Previously, I primarily worked on diffusion models, proximal algorithm modeling, and image restoration. I also gained experience in some high-level vision tasks during the internship at OpenGVLab, advised by Wenhai Wang.

If you are looking for an internship at Tencent Hunyuan3D, you could send email to laizeqiang@outlook.com.

Selected Publications
  1. Hunyuan3D 3.0: System Card
    Preprint, Report.
    Zeqiang Lai, Yunfei Zhao, Haolin Liu, Zibo Zhao, Qingxiang Lin, Zhihao Liang, Bowen Zhang, Xianghui Yang, Yifei Huang, Xin Huang, Li Wang, Xin Yang, and 12 more authors
  2. Hunyuan3D 2.5: Towards High-Fidelity 3D Assets Generation with Ultimate Details
    Preprint, arXiv preprint arXiv:2506.16504. [Code]
    Zeqiang Lai*, Yunfei Zhao*, Haolin Liu*, Zibo Zhao, Qingxiang Lin, Huiwen Shi, Xianghui Yang, Mingxin Yang*, Shuhui Yang*, Yifei Feng*, Sheng Zhang, Xin Huang, and 14 more authors
  3. FlashVDM: Unleashing Vecset Diffusion Model for Fast Shape Generation
    ICCV 2025 Highlight, International Conference on Computer Vision. [Code]
    Zeqiang Lai*, Yunfei Zhao*, Zibo Zhao, Haolin Liu, Fuyun Wang, Huiwen Shi, Xianghui Yang, Qingxiang Lin, Jingwei Huang, Yuhong Liu, Jie Jiang, Chunchao Guo, and 1 more author
  4. Hunyuan3D 2.0: Scaling Diffusion Models for High Resolution Textured 3D Assets Generation
    Preprint, arXiv preprint arXiv:2501.12202. [Website] [Code]
    Zibo Zhao*, Zeqiang Lai*, Qingxiang Lin*, Yunfei Zhao*, Haolin Liu, Shuhui Yang*, Yifei Feng*, Mingxin Yang*, Sheng Zhang*, Xianghui Yang, Huiwen Shi, Sicong Liu, and 59 more authors
Experiences
Awards
  • Doctoral Research Incentive Program by the Chinese Institute of Electronics and Tencent (2025)
  • Hong Kong Postgraduate Scholarships (2025)
  • National Scholarship China (2022)
  • Academic Scholarship of Beijing Institute of Technology (2020,2022)
  • Honorable Mention, Interdisciplinary Contest in Modeling (2019)
  • First Prize of China Undergraduate Mathematical Contest in Modeling, Beijing (2018)
  • Scholarship for Outstanding Students (2017,2018)